Freescale Semiconductor, Inc.
Ge ne ra l Re le a se Sp e c ific a tion — MC68HC705JJ7/ MC68HC705JP7
Se c tion 16. Me c ha nic a l Sp e c ific a tions
16.1 Conte nts
16.2 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .221
16.3 20-Pin Plastic Dual In-Line Package (Case 738) . . . . . . . . . .222
16.4 20-Pin Small Outline Integrated Circuit (Case 751D) . . . . . . .222
16.5 28-Pin Plastic Dual In-Line Package (Case 710) . . . . . . . . . .223
16.6 28-Pin Small Outline Integrated Circuit (Case 751F) . . . . . . .223
16.7 20-Pin Windowed Ceramic Integrated Circuit (Case 732) . . .224
16.8 28-Pin Windowed Ceramic Integrated Circuit (Case 733A) . .224
16.2 Introd uc tion
The MC68HC705JJ7 is available in a 20-pin plastic dual in-line package
(PDIP), a small outline integrated circuit (SOIC) package, and a 20-pin
windowed ceramic package.
The MC68HC705JP7 is available in a 28-pin plastic dual in-line package
(PDIP), a 28-pin small outline integrated circuit (SOIC) package, and a
28-pin windowed ceramic package.
The following figures show the latest packages at the time of this
publication. To make sure that you have the latest package
specifications, contact one of the following:
• Local Motorola Sales Office
• Motorola Fax Back System (Mfax™)
– Phone 1-602-244-6609
– EMAIL RMFAX0@email.sps.mot.com;
http://sps.motorola.com/mfax/
• Worldwide Web (wwweb) home page at http://motorola.com/sps/
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.
MC68HC705JJ7/MC68HC705JP7 — Rev. 2.0
Mechanical Specifications
General Release Specification
For More Information On This Product,
Go to: www.freescale.com