Freescale Semiconductor, Inc.
GENERAL RELEASE SPECIFICATION
TABLE OF CONTENTS
Title
Section
Page
SECTION 13
MECHANICAL SPECIFICATIONS
13.1 28-Pin Plastic Dual In-Line Package (Case 710-02) .....................................13-1
13.2 28-Pin Small Outline Integrated Circuit Package (Case 751F-04) ................13-2
SECTION 14
ORDERING INFORMATION
14.1 MCU Ordering Forms ....................................................................................14-1
14.2 Application Program Media ...........................................................................14-2
14.3 ROM Program Verification ............................................................................14-3
14.4 ROM Verification Units (RVUs) .....................................................................14-3
vi
Rev. 2.0
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