ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
THERMAL RESISTANCE (7)
Thermal Resistance, Junction to Ambient, Single-Layer Board (1s) (8)
Thermal Resistance, Junction to Ambient, Four-Layer Board (2s2p) (9)
Thermal Resistance, Junction to Board (10)
RθJA
RθJMA
RθJB
139
43
°C/W
°C/W
°C/W
22
Notes
7. The PVIN, SW, and PGND pins comprise the main heat conduction paths.
8. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
9. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the
board.
10. Thermal resistance between the device and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
34713
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
FREESCALE [ Freescale ]
