ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
80
70
60
50
40
30
20
10
0
R
R
x
θ
JA11
JA22
θ
R
JA12 = R
θJA21
θ
0
300
Heat spreading area A [mm²]
600
Figure 3. Device on Thermal Test Board RθJA
100
10
1
R
x
θ
JA11
JA22
R
θ
R
= R
θJA21
θ
JA12
0.1
1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
Time[s]
Figure 4. Transient Thermal Resistance RθJA (1 W Step Response)
Device on Thermal Test Board Area A = 600(mm2)
33984
Analog Integrated Circuit Device Data
Freescale Semiconductor
36