ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V ≤ VDD ≤ 5.5 V, 6.0 V ≤ VPWR ≤ 27 V, -40°C ≤ TA ≤ 125°C, unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
POWER OUTPUT TIMING (CONTINUED)
Over-current Low Detection Blanking Time (OCLT[1:0])
ms
tOCL0
tOCL1
tOCL2
tOCL3
00
01
10
11
108
7.0
155
10
202
13
0.8
1.2
1.6
0.08
0.15
0.25
Over-current High Detection Blanking Time
CS to CSNS Valid Time(23)
tOCH
1.0
–
10
–
20
10
μs
μs
tCNSVAL
Output Switching Delay Time (OSD[2:0])
ms
tOSD0
tOSD1
tOSD2
tOSD3
tOSD4
tOSD5
tOSD6
tOSD7
000
001
010
011
100
101
110
111
–
0.0
75
–
52
95
105
157
210
262
315
367
150
225
300
375
450
525
195
293
390
488
585
683
Watchdog Timeout (WD[1:0])(24)
ms
00
01
10
11
tWDTO0
tWDTO1
tWDTO2
tWDTO3
434
207
620
310
806
403
1750
875
2500
1250
3250
1625
SPI INTERFACE CHARACTERISTICS
Recommended Frequency of SPI Operation
Required Low-state Duration for RST(25)
fSPI
–
–
–
3.0
MHz
ns
tWRST
50
167
Notes
23. Time necessary for the CSNS to be within ±5% of the targeted value.
24. Watchdog timeout delay measured from the rising edge of WAKE to RST from a sleep state condition to output turn-ON with the output
driven OFF and FSI floating. The values shown are for WDR setting of [00]. The accuracy of tWDTO is consistent for all configured
watchdog timeouts.
25. RST low duration measured with outputs enabled and going to OFF or disabled condition.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
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