REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
•
•
Implemented Revision History page
Converted to Freescale format
5/2006
7.0
•
•
Updated data sheet format
11/2006
8.0
Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
Maximum Ratings on page 4. Added note with instructions to obtain this information from
www.freescale.com.
11/2006
12/2006
•
•
Minor correction changes to Figure 1 and ordering information
9.0
Restated note Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC
standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels
(MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter
the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. on
page 4
10.0
33790
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
FREESCALE [ Freescale ]
