MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
ELECTRICAL RATINGS
Power Supply Voltage
Analog Signal Input
(1)
Logic Signal Input
WAKE1~4B
CLR, SLEEP, CLKIN, SCKIN, DATA, STRB
VGSEL1,2
Output Power Current
V
CC1
Power Supply Circuit
V
CC2
Power Supply Circuit
SREG1 Power Supply Circuit
SREG2 Power Supply Circuit
SREG3 Power Supply Circuit
VG Power Supply Circuit
RSTO1B Power Supply Circuit
Open-Drain Output Apply Voltage
RSTO1B
LSWO
ESD Voltage
Human Body Model (HBM)
Machine Model (MM)
(4)
(3)
(2)
Symbol
Value
Unit
V
B
V
INAN
V
ILRSTB
V
ILGC
V
ILGSEL
I
OVO1
I
OVO2
I
OREG1
I
OREG2
I
OREG3
I
OVG
I
ORSTB
V
IODR
V
IODV
V
ESD1
V
ESD2
V
CDM
-0.5 to 5.0
-0.5 to VO1+0.5
V
V
V
-0.5 to V_STBY+0.5
-0.5 to VO1+0.5
-0.5 to VB+0.5
mA
120
100
80
100
80
8
-20
V
-0.5 to 3.3
-0.5 to 3.3
V
±
1500
±
200
±
750
Charge Device Model (CDM)
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Storage Temperature
Thermal Resistance
(5)
Junction to Ambient
Lead Soldering Temperature
(6)
°C
T
A
T
J
T
STG
R
θ
JA
T
SOLDER
-10 to 65
150
-50 to 150
69
°C
°
C/W
°C
260
Notes
1. VREF, DTC1, DTC2, SREGC1, SREGC2, SREGC3 and RST1ADJ.
2. Includes the series pass power supply circuit output current.
3. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω).
4.
5.
6.
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
Ω)
and in accordance with the system
module specification with a capacitor 0.01
µF
connected from OUT to GND.
Device mounted on a 2s2p test board, in accordance with JEDEC JESD51-6 and JESD51-7.
Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.
18730
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
