PACKAGE DIMENSIONS
E1
B
A
2X
E3
GATE LEAD
DRAIN LEAD
D
D1
4X
e
4X
b1
M
aaa
C A
2X
D2
2X
E
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M−1994.
3. DATUM PLANE −H− IS LOCATED AT THE TOP OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE TOP OF THE PARTING LINE.
4. DIMENSIONS “D" AND “E1" DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS .006 PER SIDE. DIMENSIONS “D" AND “E1" DO
INCLUDE MOLD MISMATCH AND ARE DETER−
MINED AT DATUM PLANE −H−.
5. DIMENSION “b1" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE .005 TOTAL IN EXCESS
OF THE “b1" DIMENSION AT MAXIMUM MATERIAL
CONDITION.
F
DATUM
PLANE
ZONE J
H
c1
A
A1
2X
E2
A2
NOTE 7
SEATING
C
PLANE
E5
E4
PIN 5
6. DATUMS −A− AND −B− TO BE DETERMINED AT
DATUM PLANE −H−.
7. DIMENSION A2 APPLIES WITHIN ZONE “J" ONLY.
8. HATCHING REPRESENTS THE EXPOSED AREA
OF THE HEAT SLUG.
NOTE 8
INCHES
DIM MIN MAX
MILLIMETERS
MIN
2.54
0.99
1.02
18.08
17.48
0.28
15.24
14
8.97
3.35
3.15
6.86
8.79
MAX
2.64
1.09
1.07
18.29
17.58
0.48
− − −
14.2
9.07
3.56
3.35
− − −
A
A1
A2
D
.100
.039
.040
.712
.688
.011
.600
.551
.353
.132
.124
.270
.346
.104
.043
.042
.720
.692
.019
− − −
.559
.357
.140
.132
− − −
4
1
2
D1
D2
D3
E
D3
E1
E2
E3
E4
E5
F
3
.350
8.89
.025 BSC
0.64 BSC
b1
c1
e
.164
.007
.170
.011
4.17
0.18
4.32
0.28
.106 BSC
.004
2.69 BSC
0.10
aaa
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. GATE
5. SOURCE
CASE 1486-03
ISSUE C
E5
BOTTOM VIEW
TO-270 WB-4
PLASTIC
MRF5S4125NR1
MRF5S4125NR1 MRF5S4125NBR1
RF Device Data
Freescale Semiconductor
10
FREESCALE [ Freescale ]
