M
EDIUM
P
OWER
PHEMT MMIC
•
ASSEMBLY DRAWING
LMA442
Notes:
•
Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
•
The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
•
Bond on bond or stitch bond acceptable.
•
Conductor over conductor acceptable. Conductors must not short.
Phone:
(408) 988-1845
Fax:
(408) 970-9950
http://
www.filss.com
Revised:
06/21/01
Email:
sales@filss.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
