FPD3000SOT89
Datasheet v3.0
D
EVICE
F
OOT
P
RINT
:
A
PPLICATION
N
OTES
& D
ESIGN
D
ATA
:
Application Notes and design data including S-
parameters, noise parameters and device
model are available on request.
R
ELIABILITY
:
A MTTF of 4.2 million hours at a channel
temperature of 150°C is achieved for the
process used to manufacture this device.
D
ISCLAIMERS
:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
Units in inches
O
RDERING
I
NFORMATION
:
P
REFERRED
A
SSEMBLY
I
NSTRUCTIONS
:
This package is compatible with both lead free
and leaded solder reflow processes as defined
within IPC/JEDEC J-STD-020C. The maximum
package temperature should not exceed
260°C.
P
ART
N
UMBER
FPD3000SOT89
FPD3000SOT89E
FPD3000SOT89(E)-BB
FPD3000SOT89(E)-BA
FPD3000SOT89(E)-BC
FPD3000SOT89(E)-BD
FPD3000SOT89(E)-BE
FPD3000SOT89(E)-BG
D
ESCRIPTION
Packaged pHEMT
RoHS compliant Packaged pHEMT
0.9 GHz evaluation board
1.85 GHz evaluation board
2.0 GHz evaluation board
2.2 GHz evaluation board
2.4 GHz evaluation board
2.6 GHz evaluation board
H
ANDLING
P
RECAUTIONS
:
To avoid damage to
the
devices
care
should be exercised
during
handling.
Proper
Electrostatic
Discharge
(ESD)
precautions should be observed at all stages
of storage, handling, assembly, and testing.
ESD/MSL R
ATING
:
These devices should be treated as Class 0 (0-
250 V) using the human body model as
defined in JEDEC Standard No. 22-A114.
The device has a MSL rating of Level 2. To
determine this rating, preconditioning was
performed to the device per, the Pb-free solder
profile defined within IPC/JEDEC J-STD-020C,
Moisture / Reflow sensitivity classification for
non-hermatic solid state surface mount
devices.
7
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website:
www.filtronic.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
