Preliminary Data Sheet
2.1
FMS2013
Absolute Maximum Ratings:
Parameter
Max Input Power
Control Voltage
Operating Temperature
Storage Temperature
Symbol
P
in
V
ctrl
T
OP
T
OP
Absolute Maximum
+30dBm
+5V
-40°C to +100°C
-55°C to +150°C
Note:
Exceeding any one of these absolute maximum ratings may cause permanent damage to the
device.
Truth Table:
V
ctrl1
High
Low
V
ctrl2
Low
High
RFIN-RF01
On
Off
RFIN-RF02
Off
On
Note:
‘High’
‘Low’
= >2.5V & <5V
= <0.2V
Pad and Die Layout:
E
D
C
B
A
H
Pad
Reference
A
B
Pad
Name
G1
RFI
C2
C1
RFO1
G2
G3
RFO2
Description
GND1
RFIN
Vctrl1
Vctrl2
RFO1
GND2
GND3
RFO2
Pin Coordinates
(µm)
159 , 286
159 , 446
159 , 606
159 , 766
757 , 857
757 , 555
757 , 414
757 , 112
F
G
C
D
E
F
G
H
Note:
Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size (µm)
870 x 970
Die Thickness
(µm)
150
Min. Bond Pad
Pitch (µm)
141
Min. Bond pad
Opening (µm)
94 x 94
2
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790
Fax: +1 (408) 850 5766
Email:
sales@filss.com
Website: www.filcs.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
