Preliminary Data Sheet
2.2
FMS2007
Pad and Die Layout:
N
M
A
B
C
D
E
L
K
J
I
H
F
Pad Number
A
B
C
D
E
F
G
H
I
J
K
L
M
N
G
Description
Ground
Antenna 1
Ground
Antenna 2
Ground
RX-Ant1
TX-Ant2
Ground
Receive
Ground
Transmit
Ground
RX-Ant2
Tx-Ant1
Pad Name
GND
ANT1
GND
ANT2
GND
V1
V3
GND
RX
GND
TX
GND
V2
V4
Pin Coordinates
(x
µm,
y
µm)
(142.1 , 709.0)
(142.1 , 581.6)
(142.1 , 448.5)
(142.1 ,327.9)
(142.1 , 201.4)
(349.8 , 88.5)
(522.2 , 88.5)
(769.2 , 201.4)
(769.2 , 327.9)
(769.2 , 448.5)
(769.2 , 581.6)
(769.2 , 709.0)
(522.2 , 807.7)
(349.8 , 807.7)
Note:
Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size (µm)
897x929
Die Thickness (µm)
150
Min. Bond Pad
Pitch(µm)
127
Min. Bond pad
opening (µm)
80x80
3
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790
Fax: +1 (408) 850 5766
Email:
sales@filcsi.com
Website: www.filcs.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
