Preliminary Data Sheet
1.0
FMS2002 ES1
Connection on Board*
RF1
RF3
V3
RF2
V1
ANT
V2
SP3T Bonding Configuration
Pad Number
1
2
3
4
5
6
7
RF input port 1
RF input port 2
DC Control line 2
RF input port 3
DC Control line 1
Antenna
DC Control line 3
Port
RF 1
RF 2
Vctrl 2
RF 3
Vctrl 1
ANT
Vctrl 3
Symbol
*
RF4, RF 5, V4 and V5 lines are unused.
Bonding Pad Layout
97 µm (x)
593 µm (x)
1
792
µm
(y)
5
792
µm
(y)
2
551.5
µm
(y)
6
SP3T F1
554.75
µm
(y)
3
319
µm
(y)
4
48.5
µm
(y)
7
48.5
µm
(y)
0.00
mm
97 µm (x)
593 µm (x)
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd,
Heighington Lane Business Park, Newton Aycliffe, Co Durham. DL5 6JW.
Contact Details: Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email:
sales@filcs.com
Website:
www.filcs.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
