FMA3014
Datasheet v3.0
P
REFERRED
A
SSEMBLY
I
NSTRUCTIONS
:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The recommended die attach is gold/tin
eutectic solder under a nitrogen atmosphere.
Stage temperature should be 280-290°C;
maximum time at temperature is one minute.
The recommended wire bond method is
thermo-compression wedge bonding with 0.7
or 1.0 mil (0.018 or 0.025 mm) gold wire.
Stage temperature should be 250-260°C.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
O
RDERING
I
NFORMATION
:
P
ART
N
UMBER
FMA3014
(Gel-pak available on request)
D
ESCRIPTION
Die in Waffle-pack
H
ANDLING
P
RECAUTIONS
:
To avoid damage to the devices care should
be exercised during handling.
Proper
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing.
These
devices should be treated as Class 1A (250-
500V) as defined in JEDEC Standard No. 22-
A114. Further information on ESD control
measures can be found in MIL-STD-1686 and
MIL-HDBK-263.
A
PPLICATION
N
OTES
& D
ESIGN
D
ATA
:
Application Notes and design data including S-
parameters, noise data and large-signal
models are available on request.
D
ISCLAIMERS
:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
6
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email:
sales@filcs.com
Tel: +44 (0) 1325 301111
Website:
www.filtronic.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
