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FMA219_1 参数 Datasheet PDF下载

FMA219_1图片预览
型号: FMA219_1
PDF下载: 下载PDF文件 查看货源
内容描述: X波段MMIC低噪声放大器 [X-BAND LNA MMIC]
分类和应用: 放大器
文件页数/大小: 5 页 / 421 K
品牌: FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
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FMA219
Datasheet v3.0
R
ECOMMENDED
A
SSEMBLY
S
CHEMATIC
:
75µm nominal gap on
each side
Input and output thin film
substrates with 50Ω microstrip
transmission lines. Substrate
thickness 250µm or thinner is
recommended.
25µm dia. Au wire (x2) on
input and output ports, less
than 1000µm length each
Note: The supply de-coupling
capacitor (150 pF recommended
value) should be placed as close
to the MMIC as practical.
150pF
capacitor
To +V
DD
250µm Au ribbon
recommended
P
REFERRED
A
SSEMBLY
I
NSTRUCTIONS
:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The back of the die is metallised and the
recommended mounting method is by the use
of
conductive
epoxy
following
the
manufacturer’s
recommended
curing
temperature.
For eutectic 80/20 gold/tin
solder, use a stage temperature of 280-300°C
for a maximum time of 60s. Use forming gas
(90%N2, 10% H2) for best results.
Recommended lead bond technique is
thermocompression wedge bonding with 25µm
diameter wire. The bond tool force shall be
35-38g. Bonding stage temperature shall be
230-240°C, heated tool (150-160°C) is
recommended.
Ultrasonic bonding is not
recommended.
should be observed at all stages of storage,
handling, assembly, and testing.
These
devices should be treated as Class 0 (0-250 V)
as defined in JEDEC Standard No. 22-A114.
Further information on ESD control measures
can be found in MIL-STD-1686 and MIL-
HDBK-263.
A
PPLICATION
N
OTES
& D
ESIGN
D
ATA
:
Application Notes and design data including S-
parameters are available on request
D
ISCLAIMERS
:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
O
RDERING
I
NFORMATION
:
P
ART
N
UMBER
FMA219
H
ANDLING
P
RECAUTIONS
:
To avoid damage to the devices care should
be exercised during handling.
Proper
Electrostatic Discharge (ESD) precautions
5
D
ESCRIPTION
Die
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website:
www.filtronic.com