Datasheet v3.0
DEVICE FOOT PRINT:
The device has a MSL rating of Level 2. To
determine this rating, preconditioning was
performed to the device per, the Pb-free solder
profile defined within IPC/JEDEC J-STD-020C,
Moisture / Reflow sensitivity classification for
non-hermatic solid state surface mount
devices.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters, noise parameters and device
model are available on request.
RELIABILITY:
Units in inches
A MTTF of 7.4 million hours at a channel
temperature of 150°C is achieved for the
process used to manufacture this device.
NOTE: Drawing available on Website
DISCLAIMERS:
PREFERRED ASSEMBLY INSTRUCTIONS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
This package is compatible with both lead free
and leaded solder reflow processes as defined
within IPC/JEDEC J-STD-020C. The maximum
package temperature should not exceed
260°C.
ORDERING INFORMATION:
PART NUMBER
FPD750SOT89
DESCRIPTION
HANDLING PRECAUTIONS:
To avoid damage to
Packaged pHEMT
FPD750SOT89E
Lead free Packaged pHEMT
the
devices
care
RoHS Compliant Packaged pHEMT with
enhanced passivation (Recommended for
New Designs)
should be exercised
during
Proper
FPD750SOT89CE
handling.
Electrostatic
Discharge
(ESD)
precautions should be observed at all stages
of storage, handling, assembly, and testing.
EB750SOT89(E)-BB
EB750SOT89(E)-BA
EB750SOT89(E)-BC
EB750SOT89(E)-BE
EB750SOT89(E)-BG
EB750SOT89(E)-AH
EB750SOT89(E)-AJ
0.9 GHz evaluation board
1.85 GHz evaluation board
2.0 GHz evaluation board
2.4 GHz evaluation board
2.6 GHz evaluation board
3.5 GHz evaluation board
5.0 – 5.75 GHz evaluation board
ESD/MSL RATING:
These devices should be treated as Class 1A
(250-500 V) using the human body model as
defined in JEDEC Standard No. 22-A114.
12
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com