Datasheet v3.0
profile defined within IPC/JEDEC J-STD-020C,
Moisture / Reflow sensitivity classification for
non-hermetic solid state surface mount devices
PCB FOOT PRINT
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters, noise parameters and device
model are available on request.
RELIABILITY:
A MTTF of 4.2 million hours at a channel
temperature of 150°C is achieved for the
process used to manufacture this device.
Units in inches
DISCLAIMERS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
PREFERRED ASSEMBLY INSTRUCTIONS:
ORDERING INFORMATION:
This package is compatible with both lead free
and leaded solder reflow processes as defined
within IPC/JEDEC J-STD-020C. The maximum
package temperature should not exceed
260°C.
PART NUMBER
FPD750SOT343
DESCRIPTION
Packaged pHEMT
FPD750SOT343E
Lead free Packaged pHEMT
HANDLING PRECAUTIONS:
RoHS Compliant Packaged pHEMT
with enhanced passivation
To avoid damage to the devices care should
FPD750SOT343CE
be exercised during handling.
Proper
(Recommended for New Designs)
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing.
EB750SOT343-BB
EB750SOT343-BA
EB750SOT343-BC
EB750SOT343-BE
EB750SOT343-BG
EB750SOT343-AH
0.9 GHz evaluation board
1.85 GHz evaluation board
2.0 GHz evaluation board
2.4 GHz evaluation board
2.6 GHz evaluation board
3.5 GHz evaluation board
ESD/MSL RATING:
These devices should be treated as Class 1A
(250V - 500V) using the human body model as
defined in JEDEC Standard No. 22-A114.
The device has a MSL rating of Level 1. To
determine this rating, preconditioning was
performed to the device per, the Pb-free solder
11
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
