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EB750DFN-BE 参数 Datasheet PDF下载

EB750DFN-BE图片预览
型号: EB750DFN-BE
PDF下载: 下载PDF文件 查看货源
内容描述: 低噪声高线性度PACKAGED PHEMT [LOW NOISE HIGH LINEARITY PACKAGED PHEMT]
分类和应用:
文件页数/大小: 9 页 / 499 K
品牌: FILTRONIC [ FILTRONIC COMPOUND SEMICONDUCTORS ]
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FPD750DFN  
Datasheet v3.0  
1
ABSOLUTE MAXIMUM RATING :  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
Drain-Source Current  
Gate Current  
SYMBOL  
VDS  
TEST CONDITIONS  
-3V < VGS < +0V  
ABSOLUTE MAXIMUM  
8V  
VGS  
0V < VDS < +8V  
-3V  
IDS  
For VDS > 2V  
IDss  
IG  
Forward or reverse current  
Under any acceptable bias state  
Under any acceptable bias state  
Non-Operating Storage  
See De-Rating Note below  
Under any bias conditions  
2 or more Max. Limits  
7.5mA  
175mW  
175°C  
-55°C to 150°C  
1.5W  
2
RF Input Power  
PIN  
Channel Operating Temperature  
Storage Temperature  
TCH  
TSTG  
PTOT  
Comp.  
Total Power Dissipation  
Gain Compression  
5dB  
3
Simultaneous Combination of Limits  
Notes:  
1TAmbient = 22°C unless otherwise noted; exceeding any one of these absolute maximum ratings may cause  
permanent damage to the device  
2Max. RF Input Limit must be further limited if input VSWR > 2.5:1  
3Users should avoid exceeding 80% of 2 or more Limits simultaneously  
4Total Power Dissipation defined as: PTOT (PDC + PIN) – POUT  
,
where PDC: DC Bias Power, PIN: RF Input Power, POUT: RF Output Power  
Total Power Dissipation to be de-rated as follows above 22°C:  
PTOT= 1.5 - (0.011W/°C) x TPACK  
where TPACK= source tab lead temperature above 22°C  
(coefficient of de-rating formula is the Thermal Conductivity)  
Example: For a 65°C carrier temperature: PTOT = 1.5W – (0.011 x (65 – 22)) = 1.03W  
5The use of a filled via-hole directly beneath the exposed heatsink tab on the bottom of the package is strongly  
recommended to provide for adequate thermal management. Ideally the bottom of the circuit board is affixed to a  
heatsink or thermal radiator  
BIASING GUIDELINES:  
Active bias circuits provide good performance stabilisation over variations of operating  
temperature, but require a larger number of components compared to self-bias or dual-biased.  
Such circuits should include provisions to ensure that Gate bias is applied before Drain bias,  
otherwise the pHEMT may be induced to self-oscillate  
Dual-bias circuits are relatively simple to implement, but will require a regulated negative voltage  
supply for depletion-mode devices.  
For standard Class A operation, a 50% of IDSS bias point is recommended. A small amount of  
RF gain expansion prior to the onset of compression is normal for this operating point. Note that  
pHEMTs, since they are “quasi- E/D mode” devices, exhibit Class AB traits when operated at 50%  
of IDSS. To achieve a larger separation between P1dB and IP3, an operating point in the 25% to  
33% of IDSS range is suggested. Such Class AB operation will not degrade the IP3 performance.  
2
Specifications subject to change without notice  
Filtronic Compound Semiconductors Ltd  
Tel: +44 (0) 1325 301111  
Fax: +44 (0) 1325 306177  
Email: sales@filcs.com  
Website: www.filtronic.com