FM25Q64ꢀ
ꢀ
13.4ꢀ8ꢁcontactꢀ6x5ꢀWSONꢀCont’d.ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
MILLIMETERSꢀ
SYMBOLꢀ
INCHESꢀ
MINꢀ
TYP.ꢀ
MAXꢀ
MINꢀ
TYP.ꢀ
MAXꢀ
SOLDERꢀPATTERNꢀ
Mꢀ
Nꢀ
Pꢀ
Qꢀ
Rꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
3.40ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
0.1338ꢀ
0.1692ꢀ
0.2360ꢀ
0.0196ꢀ
0.0255ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
4.30ꢀ
6.00ꢀ
0.50ꢀ
0.75ꢀ
ꢀ
ꢀ
Notes:ꢀ
1.ꢀ Advancedꢀ Packagingꢀ Information;ꢀ pleaseꢀ contactꢀ FIDELIXꢀ SEMICONDUCTORꢀ forꢀ theꢀ latestꢀ
minimumꢀandꢀmaximumꢀspecifications.ꢀ
2.ꢀBSCꢀ=ꢀBasicꢀleadꢀspacingꢀbetweenꢀcenters.ꢀ
3.ꢀDimensionsꢀDꢀandꢀE1ꢀdoꢀnotꢀincludeꢀmoldꢀflashꢀprotrusionsꢀandꢀshouldꢀbeꢀmeasuredꢀfromꢀtheꢀbottomꢀ
ofꢀtheꢀpackage.ꢀ
4.ꢀTheꢀmetalꢀpadꢀareaꢀonꢀtheꢀbottomꢀcenterꢀofꢀtheꢀpackageꢀisꢀconnectedꢀtoꢀtheꢀdeviceꢀgroundꢀ(GNDꢀ
pin).ꢀAvoidꢀplacementꢀofꢀexposedꢀPCBꢀbiasꢀunderꢀtheꢀpad.ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
preliminary(Aug.18.2010)ꢀ ꢀ ꢀ ꢀ
59ꢀ
FIDELIX [ FIDELIX ]
