Tape Specifications
12.0 ± 0.1
4.0 ± 0.1
4.90 ± 0.20
Ø1.55 ± 0.05
1.75 ± 0.10
4.0 ± 0.1
0.30 ± 0.05
7.5 ± 0.1
16.0 ± 0.3
10.30± 0.20
13.2 ± 0.2
Ø1.6 ± 0.1
10.30 ± 0.20
User Direction of Feed
0.1 MAX
Reflow Profile
300
250
200
150
100
50
215C, 10–30 s
225C peak
Time above 183C, 60–150 sec
Ramp up = 3C/sec
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
• Peak reflow temperature: 225C (package surface temperature)
• Time of temperature higher than 183C for 60–150 seconds
• One time soldering reflow is recommended
©2005 Fairchild Semiconductor Corporation
6N135, 6N136, HCPL2503, HCPL4502, HCPL2530, HCPL2531 Rev. 1.0.7
www.fairchildsemi.com
11
FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
