FDS9431A_F085
P-Channel
2.5V
Specified
MOSFET
Electrical Characteristics
Symbol
BV
DSS
DBV
DSS
DT
J
I
DSS
I
GSSF
I
GSSR
T
A
= 25°C unless otherwise noted
Parameter
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate-Body Leakage Current,
Forward
Gate-Body Leakage Current,
Reverse
(Note 2)
Test Conditions
V
GS
= 0 V, I
D
= -250
mA
I
D
= -250
mA,Referenced
to 25°C
V
DS
= -16 V, V
GS
= 0 V
V
GS
= 8 V, V
DS
= 0 V
V
GS
= -8 V, V
DS
= 0 V
Min
-20
Typ
Max Units
V
Off Characteristics
-28
-1
100
-100
mV/°C
mA
nA
nA
On Characteristics
V
GS(th)
DV
GS(th)
DT
J
R
DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain-Source
On-Resistance
V
DS
= V
GS
, I
D
= -250
mA
I
D
= -250
mA,Referenced
to 25°C
V
GS
= -4.5 V, I
D
= -3.5 A
V
GS
= -2.5 V, I
D
= -3.0 A
V
GS
= -4.5 V, I
D
= -3.5 A
T
J
=125°C
V
GS
= -4.5 V, V
DS
=-5 V
V
DS
= -5 V, I
D
= -3.5 A
-0.4
-0.6
2
0.110
0.140
0.155
-1
V
mV/°C
0.130
0.180
0.220
W
W
W
A
I
D(on)
g
FS
On-State Drain Current
Forward Transconductance
-10
6.5
S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
(Note 2)
V
DS
= -10 V, V
GS
= 0 V,
f = 1.0 MHz
405
170
45
pF
pF
pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
= -5 V, I
D
= -1 A,
V
GS
= -4.5 V, R
GEN
= 6
W
6.5
20
31
21
13
35
50
35
8.5
ns
ns
ns
ns
nC
nC
nC
V
DS
= -5 V, I
D
= -3.5 A,
V
GS
= -4.5 V
6
0.8
1.3
Drain-Source Diode Characteristics and Maximum Ratings
I
S
V
SD
Maximum Continuous Drain-Source Diode Forward Current
Drain-Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= -2.1 A
(Note 2)
-2.1
-0.7
-1.2
A
V
Notes:
1:
R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 50° C/W when
mounted on a 1 in
2
pad of 2 oz. copper.
b) 105° C/W when
mounted on a 0.04 in
2
pad of 2 oz. copper.
c) 125° C/W on a minimum
mounting pad.
Scale 1 : 1 on letter size paper
2:
Pulse Test: Pulse Width
≤
300
µs,
Duty Cycle
≤
2.0%
FDS9431A_F085 Rev.
A
2
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