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74LCX16245MTDX 参数 Datasheet PDF下载

74LCX16245MTDX图片预览
型号: 74LCX16245MTDX
PDF下载: 下载PDF文件 查看货源
内容描述: 低电压16位双向收发器,具有5V容限输入和输出 [Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputs]
分类和应用: 逻辑集成电路光电二极管输出元件输入元件
文件页数/大小: 9 页 / 123 K
品牌: FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
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74LCX16245 Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputs
February 1994
Revised May 2005
74LCX16245
Low Voltage 16-Bit Bidirectional Transceiver
with 5V Tolerant Inputs and Outputs
General Description
The LCX16245 contains sixteen non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus ori-
ented applications. The device is designed for low voltage
(2.5V or 3.3V) V
CC
applications with capability of interfac-
ing to a 5V signal environment. The device is byte con-
trolled. Each byte has separate control inputs which could
be shorted together for full 16-bit operation. The T/R inputs
determine the direction of data flow through the device.
The OE inputs disable both the A and B ports by placing
them in a high impedance state.
The LCX16245 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s
5V tolerant inputs and outputs
s
2.3V–3.6V V
CC
specifications provided
s
4.5 ns t
PD
max (V
CC
3.3V), 20
P
A I
CC
max
s
Power down high impedance inputs and outputs
s
Supports live insertion/withdrawal (Note 1)
s
r
24 mA output drive (V
CC
3.0V)
s
Uses patented noise/EMI reduction circuitry
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human body model
!
2000V
Machine model
!
200V
s
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1:
To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
74LCX16245G
(Note 2)(Note 3)
74LCX16245MEA
(Note 3)
74LCX16245MTD
(Note 3)
Package Number
BGA54A
MS48A
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 2:
Ordering code “G” indicates Trays.
Note 3:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
© 2005 Fairchild Semiconductor Corporation
DS012001
www.fairchildsemi.com