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74LCX125MX 参数 Datasheet PDF下载

74LCX125MX图片预览
型号: 74LCX125MX
PDF下载: 下载PDF文件 查看货源
内容描述: 低压四路缓冲带5V容限输入和输出 [Low Voltage Quad Buffer with 5V Tolerant Inputs and Outputs]
分类和应用:
文件页数/大小: 11 页 / 525 K
品牌: FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
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74LCX125 Low Voltage Quad Buffer with 5V Tolerant Inputs and Outputs
March 1995
Revised February 2005
74LCX125
Low Voltage Quad Buffer
with 5V Tolerant Inputs and Outputs
General Description
The LCX125 contains four independent non-inverting buff-
ers with 3-STATE outputs. The inputs tolerate voltages up
to 7V allowing the interface of 5V systems to 3V systems.
The 74LCX125 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s
5V tolerant inputs and outputs
s
2.3V–3.6V V
CC
specifications provided
s
6.0 ns t
PD
max (V
CC
3.3V), 10
P
A I
CC
max
s
Power down high impedance inputs and outputs
s
Supports live insertion/withdrawal (Note 1)
s
r
24 mA output drive (V
CC
3.0V)
s
Implements patented noise/EMI reduction circuitry
s
Latch-up performance exceeds JEDEC 78 conditions
s
ESD performance:
Human body model
!
2000V
Machine model
!
100V
s
Leadless Pb-Free DQFN package
Note 1:
To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value of the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
74LCX125M
74LCX125MX_NL
(Note 3)
74LCX125SJ
74LCX125BQX
(Note 2)
74LCX125MTC
74LCX125MTCX_NL
(Note 3)
Package
Number
M14A
M14A
M14D
Package Description
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MLP014A Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 3.0mm
MTC14
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 2:
DQFN package available in Tape and Reel only.
Note 3:
“_NL” indicates Pb-Free package (per JEDED J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS012416
www.fairchildsemi.com