E S I
E S I
ADVANCED INFORMATION
Excel Semiconductor inc.
PHYSICAL DIMENSIONS
S08 wide - 8 pin Plastic Small Outline 208 mils Body Width Package
0.20
C A-B
4
3
H
D
SEE
DETAIL B
D
A
5
b
WITH
9
PLATING
(c)
c1
BASE
METAL
b1
4
3
7
E
E1
SECTION A-A
E1/2
E/2
θ2
0.33
C
e
b
0.07 R MIN.
0.25 M C A-B D
H
GAUGE
PLANE
B
5
A
SEATING
PLANE
//
0.10
C
θ1
A
C
L2
θ
L
A
A2
0.10
C
C
L1
SEATING PLANE
A1
DETAIL B
NOTES:
Package
SOC 008 (inches)
SOC 008 (mm)
1. All dimensions are in both inches and millimeters.
JEDEC
2. Dimensioning and tolerancing per ASME Y 14.5M - 1994.
3. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per
end. Dimension E1 does not include interlead flash or protrusion
interlead flash or protrusion shall not exceed 0.25mm per side.
D and E1 dimensions are determined at datum H.
Symbol
A
MIN
MAX
MIN
MAX
0.069
0.085
0.0098
0.075
0.018
0.018
0.0095
0.008
1.753
0.051
1.70
2.159
0.249
1.91
A1
A2
b
0.002
0.067
0.014
0.356
0.330
0.191
0.152
0.483
0.457
0.241
0.203
4. The package top may be smaller than the package bottom. Dime-
-nsions D and E1 are determined at the outmost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash. But including any mismatch between the top and
bottom of the plastic body.
b1
c
0.013
0.0075
0.006
c1
D
0.208 BSC
0.315 BSC
0.208 BSC
0.050 BSC
0.020
5.283 BSC
8.001 BSC
5283 BSC
1.27 BSC
5. Datums A and B to be determined at datum H.
E
6. “N” is the maximum number of terminal positions for the specified
package length H.
E1
e
7. The dimensions apply to the flat section of the lead between 0.10 to
0.25 mm from the lead tip.
L
0.030
0.508
0.762
8. Dimension “b” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.10 mm total in excess of the “b” dimension
at maximum material condition. The dambar cannot not be located
on the lower radius of the lead foot.
L1
L2
N
0.055 REF
0.010 BSC
8
1.40 REF
0.25 BSC
8
9. This chamfer feature is optional. If it is not present, then a pin 1
idenfifier must be located within the index area indicated.
10.Lead coplanarity shall be within 0.10 mm. As measured from the
seating plane.
θ
0’
8’
0’
5’
0’
8’
15’
θ1
θ2
5’
15’
0’
33
Rev. 0D May, 11, 2006
ES25P80
EXCELSEMI [ EXCEL SEMICONDUCTOR INC. ]
