EMP211 参数 Datasheet PDF下载

EMP211

UPDATED 06/19/2006

9.5 – 12.0 GHz Power Amplifier MMIC

ASSEMBLY DRAWING

The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and

separate the wires to minimize the mutual inductance.

CHIP OUTLINE

Chip Size 1130 x 2500 microns

Chip Thickness: 75

±

13 microns

PAD Dimensions: 100 x 100 microns

All Dimensions in Microns

Specifications are subject to change without notice.

Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085

Phone: 408-737-1711 Fax: 408-737-1868 Web:

www.excelics.com

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Revised June 2006