EMA303D-2
DATA SHEET
19.5 - 24 GHz Medium Power MMIC
ASSEMBLY DRAWING
Vdd
0.1 uF
50pF
50 ohm line on Alumina
50 ohm line on Alumina
RF INPUT
RF OUTPUT
50pF
0.1 uF
VGG
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and
separate the wires to minimize the mutual inductance.
CHIP OUTLINE
V
750
V
2350
1
D
3
D
V
D2
1500
GND
for DC check
1060
RF IN
680
RF OUT
550
0
GND
1150
V
2065
V
700
2500
V
1
GG
1
GG
1
GG
0
Chip Size 1060 x 2500 microns
Chip Thickness: 75 ± 13 microns
PAD Dimensions: 1. DC 100 x 100 microns
2. RF 80 x 68 microns
All Dimensions In Microns
EXCELICS [ EXCELICS SEMICONDUCTOR, INC. ]
