EMA205B
ASSEMBLY DRAWING
50pF
50 ohm line on Alumina
50 ohm line on Alumina
RF INPUT
RF OUTPUT
50pF
50pF
0.1uF
0.1uF
MIM
Cap.
BOND
PAD
VGG
VDD
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and separate
the wires to minimize the mutual inductance.
CAUTION: Bonding tip and wires MUST stay within pad dimensions as illustrated in CHIP OUTLINE below.
Violation may cause damages on components in chip (especially damaging output MIM capacitor as
shown on above zoom-in graph).
CHIP OUTLINE (dimensions in microns)
1060
68
330
620
(RF IN)
105
330
(RF OUT)
100
0
Chip Size 1060 x 2000 microns
Chip Thickness: 75 ± 13 microns
PAD Dimensions: 1. DC 100 x 100 microns
2. RF 80 x 68 microns
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 3 of 4
Revised May 2004
EXCELICS [ EXCELICS SEMICONDUCTOR, INC. ]
