MP7612
ELECTRICAL CHARACTERISTICS (CONT’D)
NOTES:
1
Guaranteed; not tested.
Specified values guarantee functionality.
Digital inputs should not go below digital GND or exceed DV supply voltage.
2
3
DD
4
5
6
See Figures 2 and 3. All digital input signals are specified with t = t = 10 ns 10% to 90% and timed from a 50% voltage level.
R
F
For power supply values < ꢀ2ꢁV , the output swing is limited as specified in Analog Outputs.
REF
Digital feedthrough and channel-to-channel crosstalk are heavily dependent on the board layout and environment.
Specificationsare subject to change without notice
1, 2
ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted)
V
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . +16.5 V
Analog Inputs & Outputs . . . . . . . Indefinite Shorts to
CC
V
, V , DV , AGND, DGND (provided that power
EE DD
CC
dissipation of the package spec is not exceeded)
V
EE
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –16.5 V
Operating Temperature Range
Extended Industrial . . . . . . . . . . . . . . –40°C to +85°C
DV to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . +6.5 V
DD
Maximum Junction Temperature . . . –65°C to 150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead Temperature (Soldering, 10 sec) . . . . . +300°C
V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0 V
REF
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +1 V
(Functionality guaranteed for ꢀ0.5 V only)
Package Power Dissipation Rating @ 75°C
SOIC, PLCC . . . . . . . . . . . . . . . . . . . . . . . . 1150mW
Derates above 75°C . . . . . . . . . . . . . . . . . 15mW/°C
Digital Input & Output Voltage to DGND –0.5 to DV
+0.5V
DD
NOTES:
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2
Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short
transients outside the supplies of less than 100mA for less than 100µs.
APPLICATION NOTES
Refer to Section 8 in the 1995 Data Acquisition products Databook for Applications Information
NOTE: When using these DACs to drive remote devices, the accuracy of the output can be improved by utilizing a remote analog
ground connection. The difference between the DGND and AGND should be limited toꢀ300 mV to assure normal operation. If there
is any chance that the AGND to DGND can be greater than ꢀ1 V, we recommend two back-to-back diodes be used between DGND
and AGND to clamp the voltage and prevent damage to the DAC. Using a buffer between the remote ground location and AGND may
help reduce noise induced from long lead or trace lengths.
Rev. 3.00
6
EXAR [ EXAR CORPORATION ]
