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MP7610AP 参数 Datasheet PDF下载

MP7610AP图片预览
型号: MP7610AP
PDF下载: 下载PDF文件 查看货源
内容描述: D / A转换器,输出放大器和串行数据/地址mP在控制逻辑 [D/A Converter with Output Amplifier and Serial Data/Address mP Control Logic]
分类和应用: 转换器数模转换器放大器信息通信管理
文件页数/大小: 16 页 / 517 K
品牌: EXAR [ EXAR CORPORATION ]
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MP7610
ELECTRICAL CHARACTERISTICS (CONT’D)
Parameter
DIGITAL TIMING
SPECIFICATIONS
1, 4
(CONT’D)
LD Rising Edge to SDO
Tri-state Disable
LD Rising Edge to CLK Enable
LD Set-up Time with Respect
to CLK
t
HZ2
t
LDCK
t
LDSU
50
50
45
ns
ns
ns
Symbol
Min
25
°
C
Typ
Max
Tmin to Tmax
Min
Max
Units
Test Conditions/Comments
NOTES:
1
Guaranteed; not tested.
2
Specified values guarantee functionality.
3
Digital inputs should not go below digital GND or exceed DV
DD
supply voltage.
4
See Figures 2 and 3. All digital input signals are specified with t
R
= t
F
= 10 ns 10% to 90% and timed from a 50% voltage level.
5
For power supply values <
¦2£V
REF
, the output swing is limited as specified in Analog Outputs.
6
Digital feedthrough and channel-to-channel crosstalk are heavily dependent on the board layout and environment.
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS (TA = +25
°
C unless otherwise noted)
1, 2
V
CC
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . +16.5 V
V
EE
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . --16.5 V
DV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . +6.5 V
V
REF
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +1 V
(Functionality guaranteed for
¦0.5
V only)
Digital Input & Output Voltage
to DGND . . . . . . . . . . . . . . . . . . . . --0.5 to DV
DD
+0.5V
Analog Inputs & Outputs . . . . . . . Indefinite Shorts to
V
CC
, V
EE
, DV
DD
, AGND, DGND (provided that power
dissipation of the package spec is not exceeded)
Operating Temperature Range
Extended Industrial . . . . . . . . . . . . . . --40°C to +85°C
Maximum Junction Temperature . . . --65°C to 150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead Temperature (Soldering, 10 sec) . . . . . +300°C
Package Power Dissipation Rating @ 75°C
SOIC, PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . 1150mW
Derates above 75°C . . . . . . . . . . . . . . . . . . . . 15mW/°C
NOTES:
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2
Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short
transients outside the supplies of less than 100mA for less than 100
m
s.
APPLICATION NOTES
NOTE: When using these DACs to drive remote devices, the accuracy of the output can be improved by utilizing a remote analog
ground connection. The difference between the DGND and AGND should be limited to
¦300
mV to assure normal operation. If there
is any chance that the AGND to DGND can be greater than
¦1
V, we recommend two back-to-back diodes be used between DGND
and AGND to clamp the voltage and prevent damage to the DAC. Using a buffer between the remote ground location and AGND may
help reduce noise induced from long lead or trace lengths.
Rev. 4.01
6