MP1230A/31A/32A
ORDERING INFORMATION
Package
Type
Temperature
Range
INL
(LSB)
DNL
(LSB)
Gain Error
(% FSR)
Part No.
–40 to +85°C
–40 to +85°C
–40 to +85°C
–40 to +85°C
Plastic Dip
Plastic Dip
Plastic Dip
SOIC
MP1230ABN
MP1231ABN
MP1232ABN
MP1230ABS
+1/2
+1
+3/4
+1
+0.4
+0.4
+0.4
+0.4
+0.4
+0.4
+2
+2
+1/2
+1
+3/4
+1
–40 to +85°C
–40 to +85°C
SOIC
SOIC
MP1231ABS
MP1232ABS
+2
+2
PIN CONFIGURATIONS
See Packaging Section for Package Dimensions
CS
V
DD
1
2
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
20
19
18
17
16
V
CS
WR1
AGND
DB7
DD
WR1
BYTE1/BYTE2
BYTE1/BYTE2
3
AGND
DB7
DB6
DB5
DB4
WR2
XFER
WR2
4
XFER
DB8 (DB0, LSB)
DB9 (DB1)
DB10 (DB2)
5
DB6
DB5
DB4
DB8 (DB0, LSB)
DB9 (DB1)
DB10 (DB2)
6
6
7
15
14
7
8
V
REF
DB11 MSB (DB3)
V
REF
DB11 MSB (DB3)
8
13
12
11
9
R
I
R
I
9
FB
OUT2
FB
OUT2
10
10
DGND
DGND
I
I
OUT1
OUT1
20 Pin SOIC (Jedec, 0.300”)
S20
20 Pin PDIP (0.300”)
N20
PIN OUT DEFINITIONS
PIN NO.
NAME
DESCRIPTION
PIN NO.
NAME
DESCRIPTION
1
CS
Chip Select (Active Low)
Write 1 (Active Low)
Analog Ground
12
13
I
Current Output 2
OUT2
2
WR1
AGND
DB7
DB11 (DB3)
DB10 (DB2)
DB9 (DB1)
DB8 (DB0)
Data Input Bit 11 (MSB)
Data Input Bit 3
3
14
15
16
Data Input Bit 10
Data Input Bit 2
4
Data Input Bit 7
5
DB6
Data Input Bit 6
Data Input Bit 9
Data Input Bit 1
6
DB5
Data Input Bit 5
Data Input Bit 8
Data Input Bit 0 (LSB)
7
DB4
Data Input Bit 4
8
V
Reference Input Voltage
Feedback Resistor
Digital Ground
REF
17
18
19
XFER
WR2
Transfer Control Signal (Active Low)
Write 2 (Active Low)
9
R
FB
10
11
DGND
BYTE1/
BYTE2
Byte Sequence Control
I
Current Output 1
OUT1
20
V
DD
Positive Power Supply
Rev. 2.00
2
EXAR [ EXAR CORPORATION ]
