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4450HG/3-K 参数 Datasheet PDF下载

4450HG/3-K图片预览
型号: 4450HG/3-K
PDF下载: 下载PDF文件 查看货源
内容描述: [Microprocessor, CMOS, PBGA324, ROHS COMPLIANT, HSBGA-324]
分类和应用: 外围集成电路
文件页数/大小: 92 页 / 780 K
品牌: EXAR [ EXAR CORPORATION ]
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True Hardware Random Number Generator  
2.4 Supports Multiple Host Interfaces  
• Four standard RGMII/RTBI/SGMII/SERDES interfaces (The Host-side interface can  
also support GMII/TBI. The four GMAC interfaces can optionally be configured for  
MII mode in 10/100 applications)  
• Optional Out-of-Band Control interface via RMII interface for expandability, control,  
and configuration  
• Compliant with IEEE 802.3 & IEEE 802.3z specifications  
• Supports auto-negotiated 10/100/1000 Mbps data rates for GMII, RGMII and SGMII  
Interfaces. (TBI, RTBI and SERDES interfaces only support 1Gbps)  
• Supports CSMA/CD (half-duplex) and IEEE 802.3x (full-duplex) flow control  
• Supports 802.3Q VLAN tag detection for received frames  
• Supports 802.3 jumbo frames (9022 bytes)  
• Supports 802.3z bursting (half-duplex only)  
2.5 On-chip Memory  
• On-chip memory used for local SPD, SAD storage and packet buffering  
• Reduces cost and board space when a limited number of secure tunnels is required  
2.6 Software Support  
• Software Development Kit (SDK)  
• IPsec and IPcomp fast-path embedded firmware provided by Hifn and bootloaded  
into chip at power-up  
• Optional IKE software fully integrated on chip  
• Fragment reassembly (exception handling) may be performed on-chip in the eSC or  
off-chip in the host, CPU, TOE, or Storage Processor  
2.7 Other Features  
• Supports low-cost implementations with 324-pin HSBGA package  
• On-chip PLL enables flexible low-cost external clock input  
• IEEE 1149.1 JTAG support  
• 1.0V core power with flexible I/O voltages.  
Typical power dissipation ~2.5W  
• 0.13µ process  
4450 – Data Sheet, DS-0131-06  
Page19  
Hifn Confidential  
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