DATASHEET
SMD Low Power LED
61-238/XK2C-SXXXXXXXXXX/ET
Device Selection Guide
Chip
Emitted Color
Materials
Resin Color
Water Clear
Neutral White
InGaN
Warm White
Absolute Maximum Ratings (Ta=25℃) *1
Parameter
Symbol
Rating
Unit
Reverse Voltage*1
5
VR
V
Forward Current*1
30
IF
mA
mA
mW
℃
Peak Forward Current(Duty 1/10 @ 1KHZ)*1
Power Dissipation*1
100
IFP
110
Pd
Electrostatic Discharge(HBM) *1
Operating Temperature
1000
-40 ~ +85
-40 ~ +90
ESD
Topr
Tstg
℃
Storage Temperature
℃
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Soldering Temperature
Tsol
* 1. The value are based on 1 die performance
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
IF=20mA*2
VR=5V
Viewing Angle*1
Reverse Current
2θ1/2
deg
-----
-----
120
-----
-----
50
IR
μA
*1 When three LED dies are operated simultaneously.
*2 For each die.
Copyright © 2010, Everlight All Rights Reserved. Release Date : 06-Apr.-2011. Issue No: v1
Device No: DSE-000
4
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