EUA6412
Thermal Pad Considerations
The thermal pad must be connected to ground. The
package with thermal pad of the EUA6412 requires
special attention on thermal design. If the thermal
design issues are not properly addressed, the
EUA6412 will go into thermal shutdown when
driving a heavy load.
The thermal pad on the bottom of the EUA6412
should be soldered down to a copper pad on the
circuit board. Heat can be conducted away from the
thermal pad through the copper plane to ambient. If
the copper plane is not on the top surface of the
circuit board, 8 to 10 vias of 13 mil or smaller in
diameter should be used to thermally couple the
thermal pad to the bottom plane.
For good thermal conduction, the vias must be plated
through and solder filled. The copper plane used to
conduct heat away from the thermal pad should be as
large as practical.
If the ambient temperature is higher than 25℃,a
larger copper plane or forced-air cooling will be
required to keep the EUA6412 junction temperature
below the thermal shutdown temperature (150℃). In
higher ambient temperature, higher airflow rate
and/or larger copper area will be required to keep the
IC out of thermal shutdown.
DS6412 Ver 1.0 Dec. 2006
17
EUTECH [ EUTECH MICROELECTRONICS INC ]
