EUA6027
Thermal Pad Considerations
The thermal pad must be connected to ground. The package
with thermal pad of the EUA6027 requires special attention
on thermal design. If the thermal design issues are not
properly addressed, the EUA6027 will go into thermal
shutdown when driving a heavy load.
The thermal pad on the bottom of the EUA6027 should be
soldered down to a copper pad on the circuit board. Heat can
be conducted away from the thermal pad through the copper
plane to ambient. If the copper plane is not on the top
surface of the circuit board, 8 to 10 vias of 13 mil or smaller
in diameter should be used to thermally couple the thermal
pad to the bottom plane.
For good thermal conduction, the vias must be plated
through and solder filled. The copper plane used to conduct
heat away from the thermal pad should be as large as
practical.
If the ambient temperature is higher than 25℃,a larger
copper plane or forced-air cooling will be required to keep
the EUA6027 junction temperature below the thermal
shutdown temperature (150℃). In higher ambient
temperature, higher airflow rate and/or larger copper area
will be required to keep the IC out of thermal shutdown.
DS6027 Ver 1.0 Feb. 2007
13
EUTECH [ EUTECH MICROELECTRONICS INC ]
