EUA6011A
Package Information
Use as much
copper area
as possible
Bottom view
Exposed Pad
NOTE
1. Package body sizes exclude mold flash protrusion or gate burrs
2. Tolerance ± 0.1mm unless otherwise specified
3. Coplanarity :0.1mm
4. Controlling dimension is millimeter.
5. Die pad exposure size is according to lead frame design.
6. Standard Solder Map dimension is millimeter.
7. Followed from JEDEC MO-15
DIMENSIONS IN MILLIMETERS
SYMBOLS
DIMENSIONS IN INCHES
MIN.
------
0.00
0.80
0.19
0.09
7.70
------
4.30
------
0.45
------
0
NOM.
------
------
1.00
------
------
7.80
6.40
MAX.
1.15
0.10
1.05
0.30
0.20
7.90
-----
4.50
-----
0.75
0.10
8
MIN.
------
0.000
0.031
0.007
0.004
0.303
------
0.169
------
0.018
------
0
NOM.
------
------
0.039
------
------
0.307
0.252
0.173
0.026
0.024
------
------
MAX.
0.045
0.004
0.041
0.012
0.008
0.311
------
0.177
------
0.030
0.004
8
A
A1
A2
b
C
D
E
E1
e
4.40
0.65
0.60
------
------
L
y
θ
DS6011A Ver 1.0 Mar. 2006
20
EUTECH [ EUTECH MICROELECTRONICS INC ]
