EUA5202
Package Information
Use as much
copper area
as possible
Bottom view
Exposed Pad
NOTE
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ± 0.1mm unless otherwise specified
3. Coplanarity :0.1mm
4. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact.
5. Die pad exposure size is according to lead frame design.
6. Standard Solder Map dimension is millimeter.
7. Followed from JEDEC MO-153
DIMENSIONS IN MILLIMETERS
DIMENSIONS IN INCHES
SYMBOLS
MIN.
------
0.00
0.80
0.19
0.09
7.70
------
4.30
------
0.45
------
0
NOM.
------
------
1.00
------
------
7.80
6.40
MAX.
1.15
0.10
1.05
0.30
0.20
7.90
-----
4.50
-----
0.75
0.10
8
MIN.
------
0.000
0.031
0.007
0.004
0.303
------
0.169
------
0.018
------
0
NOM.
------
------
0.039
------
------
0.307
0.252
0.173
0.026
0.024
------
------
MAX.
0.045
0.004
0.041
0.012
0.008
0.311
------
0.177
------
0.030
0.004
8
A
A1
A2
b
C
D
E
E1
e
4.40
0.65
L
0.60
------
------
y
θ
DS5202 Ver 1.6 May. 2005
23
EUTECH [ EUTECH MICROELECTRONICS INC ]
