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EM63B165TS-6ISG 参数 Datasheet PDF下载

EM63B165TS-6ISG图片预览
型号: EM63B165TS-6ISG
PDF下载: 下载PDF文件 查看货源
内容描述: [32M x 16 bit Synchronous DRAM (SDRAM)]
分类和应用: 动态存储器
文件页数/大小: 53 页 / 1439 K
品牌: ETRON [ ETRON TECHNOLOGY, INC. ]
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EM63B165TS  
EtronTech  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
CLK  
Burst  
Stop  
NOP  
WRITE A  
DIN A0  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
COMMAND  
don’t care  
DIN A1  
DIN A2  
DQ  
Figure 17. Termination of a Burst Write Operation  
(Burst Length = X)  
11 Device Deselect command (CS# = "H")  
The Device Deselect command disables the command decoder so that the RAS#, CAS#, WE#  
and Address inputs are ignored, regardless of whether the CLK is enabled. This command is similar to  
the No Operation command.  
12 AutoRefresh command  
(RAS# = "L", CAS# = "L", WE# = "H", CKE = "H", A0-A12 = Don't care)  
The AutoRefresh command is used during normal operation of the SDRAM and is analogous to  
CAS#-before-RAS# (CBR) Refresh in conventional DRAMs. This command is non-persistent, so it  
must be issued each time a refresh is required. The addressing is generated by the internal refresh  
controller. This makes the address bits a "don't care" during an AutoRefresh command. The internal  
refresh counter increments automatically on every auto refresh cycle to all of the rows. The refresh  
operation must be performed 8192 times within 64ms. The time required to complete the auto refresh  
operation is specified by tRC(min.). To provide the AutoRefresh command, all banks need to be in the  
idle state and the device must not be in power down mode (CKE is high in the previous cycle). This  
command must be followed by NOPs until the auto refresh operation is completed. The precharge time  
requirement, tRP(min), must be met before successive auto refresh operations are performed.  
13 SelfRefresh Entry command  
(RAS# = "L", CAS# = "L", WE# = "H", CKE = "L", A0-A12 = Don't care)  
The SelfRefresh is another refresh mode available in the SDRAM. It is the preferred refresh mode  
for data retention and low power operation. Once the SelfRefresh command is registered, all the inputs  
to the SDRAM become "don't care" with the exception of CKE, which must remain LOW. The refresh  
addressing and timing is internally generated to reduce power consumption. The SDRAM may remain  
in SelfRefresh mode for an indefinite period. The SelfRefresh mode is exited by restarting the external  
clock and then asserting HIGH on CKE (SelfRefresh Exit command).  
14 SelfRefresh Exit command  
This command is used to exit from the SelfRefresh mode. Once this command is registered, NOP  
or Device Deselect commands must be issued for tXSR(min.) because time is required for the  
completion of any bank currently being internally refreshed. If auto refresh cycles in bursts are  
performed during normal operation, a burst of 8192 auto refresh cycles should be completed just prior  
to entering and just after exiting the SelfRefresh mode.  
15 Clock Suspend Mode Entry / PowerDown Mode Entry command (CKE = "L")  
When the SDRAM is operating the burst cycle, the internal CLK is suspended (masked) from the  
subsequent cycle by issuing this command (asserting CKE "LOW"). The device operation is held intact  
while CLK is suspended. On the other hand, when all banks are in the idle state, this command  
performs entry into the PowerDown mode. All input and output buffers (except the CKE buffer) are  
turned off in the PowerDown mode. The device may not remain in the Clock Suspend or PowerDown  
state longer than the refresh period (64ms) since the command does not perform any refresh  
operations.  
Rev. 2.0  
16  
Jun. /2016