LM78XX
LINEAR INTEGRATED CIRCUIT
NOTES FOR USE
1. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions.
2. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short
circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider
adding circuit protection devices, such as fuses.
3. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
4. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the
IC to malfunction.
5. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards.
The IC may be damaged if there is any connection error or if pins are shorted together.
6. Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD
circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment
where the operation of this circuit is assumed.
7. Overcurrent Protection Circuit
An overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload
currents.
Continued use of the protection circuits should be avoided. Please note that the current increases negatively
impact the temperature.
8. Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the
IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly
steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
UNISONIC TECHNOLOGIES CO., LTD
www.unisonic.com.tw
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QW-R101-006.T
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