High Speed Backplane Connectors
MULTIGIG RT Tier 2 Connector System
Target Applications
I High speed telecommunica-
tions equipment
I Midrange and high-end
servers
I Networking equipment
I Blindmate design
I High speed custom
platforms
I Mass data storage
I Rugged, mission-critical
applications
Product Features
I Excellent performance to
6.25+ Gb/s–
I High density: 113 contacts
per inch provides 56 contact
pairs per inch for
differential signaling
I Options include 20.32
[.800] and 25.40 [1.000]
pitch card spacing
The MULTIGIG RT Tier 2
connector is the latest
product release to meet
customer requirements for
high-density and high-
performance two-piece
interconnects. In TE and
independent lab tests,
the MULTIGIG RT Tier 2
connector has performed
in excess of 6 Gb/s using
standard FR-4 board mate-
rial and routing techniques,
and has been demon-
strated to 10 Gb/s.
within a single connector
and electrostatic discharge
(ESD) modules to meet the
most demanding applica-
tions. Signal modules can
be customized for specific
electrical requirements —
such as sequencing — that
are critical in high speed
applications.
module. All of these options
then mate into a common
Backplane Receptacle.
I Modular options for signal,
power, keying and guidance
5
I Optimized footprints
I Robust design
The robust connector uses
daughtercard plugs with a
printed circuit board (PCB)
wafer design and back-
plane receptacles with a
completely enclosed dual-
beam design. All signal
lines use redundant points
of contact for high reliability.
I Low noise levels
I Supports differential pair
widths of 6 mils with 9 mil
spacings
Power modules are available
with two- and four-voltage
options, each circuit capa-
ble of carrying 20 amps.
The robust metal guide pin
provides eight keying
options and a unique ESD
contact to discharge static
when daughtercards are
hot-plugged.
I Single-ended, open pin
field and power wafers
available
The MULTIGIG RT Tier 2
connector is available for
both 20.32 [.800] and 25.40
[1.000] pitch card spacing.
The totally modular system
allows flexibility in choosing
signal and power modules
as well as guidance, keying,
The MULTIGIG RT Tier 2
connector system provides
the flexibility to configure
the daughtercard for
Differential, Single-ended,
Open Pin Field, or Power
Availability
Fully validated SPICE models: E-mail requests to modeling@te.com
Pro/E models and IGES models: E-mail requests to TECAD@te.com
www.te.com
IGES is a trademark of IAMBA Networks,
Inc.
PRO/E is a trademark of Parametric
Technology Corp.
149
Catalog 1773095
Revised 4-12
Dimensions are shown for
Dimensions are in millimeters
and inches unless otherwise
specified.
Canada: +1 (905) 475-6222
UK: +44 (0) 800-267666
reference purposes only.
Specifications subject
to change.
Mexico/C. Am.: +52 (0) 55-1106-0800
Latin/S. Am.: +54 (0) 11-4733-2200
Germany: +49 (0) 6251-133-1999
France: +33 (0) 1-3420-8686
Netherlands: +31 (0) 73-6246-999
China: +86 (0) 400-820-6015
www.te.com
USA: +1 (800) 522-6752
ETC [ ETC ]
