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M32L1632512A-8Q 参数 Datasheet PDF下载

M32L1632512A-8Q图片预览
型号: M32L1632512A-8Q
PDF下载: 下载PDF文件 查看货源
内容描述: [Synchronous DRAM, 512KX32, 6.5ns, CMOS, PQFP100,]
分类和应用: 时钟动态存储器内存集成电路
文件页数/大小: 54 页 / 877 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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M32L1632512A  
DEVICE OPERATIONS (Continued)  
The minimum number of clock cycles required to  
complete row precharge is calculated by dividing  
tRP” with clock cycle time and rounding up to the  
next higher integer. Care should be taken to make  
sure that burst write is completed or DQM is used  
to inhibit writing before precharge command is  
asserted. The maximum time any bank can be  
active is specified by tRAS (max). Therefore, each  
bank has to be precharged within tRAS (max) from  
the bank activate command. At the end of  
precharge, the bank enters the idle state and is ready  
to be activated again.  
AUTO REFRESH  
The storage cells of SGRAM need to be  
refreshed every 32ms to maintain data. An auto  
refresh cycle accomplishes refresh of a single  
row of storage cells. The internal counter  
increments automatically on every auto refresh  
cycle to refresh all the rows. An auto refresh  
command is issued by asserting low on  
,
CS  
and  
with high on CKE and  
WE  
.
RAS  
CAS  
The auto refresh command can only be asserted  
with both banks being in idle state and the  
device is not in power down mode (CKE is high  
in the previous cycle). The time required to  
complete the auto refresh operation is specified  
by tRC (min). The minimum number of clock  
cycles required can be calculated by driving tRC  
with clock cycle time and them rounding up to  
the next higher integer. The auto refresh  
command must be followed by NOP’s until the  
auto refresh operation is completed. Both banks  
will be in the idle state at the end of auto refresh  
operation. The auto refresh is the preferred  
refresh mode when the SGRAM is being used  
for normal data transactions. The auto refresh  
cycle can be performed once in 15.6us or the  
burst of 2048 auto refresh cycles in 32ms.  
Entry to Power Down, Auto refresh, Self refresh  
and Mode register Set etc. is possible only when  
both banks are in idle state.  
AUTO PRECHARGE  
The precharge operation can also be performed by  
using auto precharge. The SGRAM internally  
generates the timing to satisfy tRAS (min) and “tRP” for  
the programmed burst length and CAS latency.  
The auto precharge command is issued at the same  
time as burst read or burst write by asserting high  
on A9. If burst read or burst write command is  
issued with low on A9, the bank is left active until a  
new command is asserted. Once auto precharge  
command is given, no new command are possible  
to that particular bank until the bank achieves idle  
state.  
SELF REFRESH  
The self refresh is another refresh mode  
available in the SGRAM. The self refresh is the  
preferred refresh mode for data retention and  
low power operation of SGRAM. In self refresh  
mode, the SGRAM disables the internal clock  
and all the input buffers except CKE. The  
refresh addressing and timing is internally  
generated to reduce power consumption.  
BOTH BANKS PRECHARGE  
Both banks can be precharged at the same time by  
using Precharge all command. Asserting low on  
CS, RAS and WE with high on A9 after all  
banks have satisfied tRAS (min) requirement, performs  
precharge on both banks. At the end of tRP after  
performing precharge all, all banks are in idle state.  
The self refresh mode is entered from all banks  
idle state by asserting low on CS, RAS ,  
CAS and CKE with high on WE . Once the  
self refresh mode is entered, only CKE state  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jun. 2001  
Revision : 1.6  
16/54  
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