ESMT
M24L216128SA
Product Portfolio Product
Power Dissipation
Operating ICC(mA)
f = 1MHz f = fmax
VCC Range (V)
Product
Speed(ns)
Standby ISB2(µA)
Min.
2.7
Typ.
3.0
Max.
3.6
Typ.[5]
Max.
Typ.[5]
Max.
22
Typ. [5]
9
Max.
40
55
70
14
8
M24L216128SA
Notes:
1
5
15
2.Ball D3, H1, G2 and ball H6 for the FBGA package can be used to upgrade to a 4-Mbit, 8-Mbit, 16-Mbit and a 32-Mbit density,
respectively.
3.NC “no connect”—not connected internally to the die.
4.DNU (Do Not Use) pins have to be left floating or tied to Vss to ensure proper application.
5.Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ.)
,
TA = 25°C.
Elite Semiconductor Memory Technology Inc.
Publication Date : Jul. 2008
Revision : 1.2 3/14
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
