欢迎访问ic37.com |
会员登录 免费注册
发布采购

M24L216128DA-55TIG 参数 Datasheet PDF下载

M24L216128DA-55TIG图片预览
型号: M24L216128DA-55TIG
PDF下载: 下载PDF文件 查看货源
内容描述: 2兆位( 128K ×16 )伪静态RAM [2-Mbit (128K x 16) Pseudo Static RAM]
分类和应用:
文件页数/大小: 14 页 / 345 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
 浏览型号M24L216128DA-55TIG的Datasheet PDF文件第1页浏览型号M24L216128DA-55TIG的Datasheet PDF文件第2页浏览型号M24L216128DA-55TIG的Datasheet PDF文件第3页浏览型号M24L216128DA-55TIG的Datasheet PDF文件第4页浏览型号M24L216128DA-55TIG的Datasheet PDF文件第6页浏览型号M24L216128DA-55TIG的Datasheet PDF文件第7页浏览型号M24L216128DA-55TIG的Datasheet PDF文件第8页浏览型号M24L216128DA-55TIG的Datasheet PDF文件第9页  
ESMT  
M24L216128DA  
AC Test Loads and Waveforms  
Parameters  
3.0V VCC  
22000  
22000  
11000  
1.50  
Unit  
V
R1  
R2  
RTH  
VTH  
Switching Characteristics Over the Operating Range[10]  
-55 [14]  
Min.  
-70  
Parameter  
Read Cycle  
tRC  
tAA  
tOHA  
tACE  
Description  
Unit  
Max.  
Min.  
70  
Max.  
Read Cycle Time  
55[14]  
5
ns  
ns  
ns  
ns  
Address to Data Valid  
Data Hold from Address Change  
55  
70  
10  
55  
25  
70  
35  
CE1 LOW and CE2 HIGH to Data Valid  
OE LOW to Data Valid  
tDOE  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tLZOE  
tHZOE  
tLZCE  
tHZCE  
tDBE  
5
2
5
5
OE LOW to LOW Z[11, 12]  
25  
25  
OE HIGH to High Z[11, 12]  
CE1 LOW and CE2 HIGH to Low Z[11, 12]  
CE1 HIGH and CE2 LOW to High Z[11, 12]  
BLE /BHE LOW to Data Valid  
25  
55  
25  
70  
tLZBE  
tHZBE  
5
5
BLE /BHE LOW to Low Z[11, 12]  
10  
0
25  
10  
BLE /BHE HIGH to High Z[11, 12]  
Address Skew  
tSK[14]  
Write Cycle[12]  
tWC  
Write Cycle Time  
55  
45  
70  
55  
ns  
ns  
tSCE  
CE1 LOW and CE2 HIGH to Write End  
Address Set-Up to Write End  
Address Hold from Write End  
Address Set-Up to Write Start  
tAW  
tHA  
tSA  
45  
0
0
55  
0
0
ns  
ns  
ns  
Notes:  
10. Test conditions assume signal transition time of 1 V/ns or higher, timing reference levels of VCC(typ)/2, input pulse levels of 0V  
to VCC(typ), and output loading of the specified IOL/IOH and 30-pF load capacitance.  
11. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high-impedance state.  
12. High-Z and Low-Z parameters are characterized and are not 100% tested.  
13. The internal write time of the memory is defined by the overlap of WE , CE1 = VIL, CE2 = VIH, BHE and/or BLE = VIL.  
All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data  
input set-up and hold timing should be referenced to the edge of the signal that terminates write.  
14. To achieve 55-ns performance, the read access should be Chip-enable controlled. In this case tACE is the critical parameter  
and tSK is satisfied when the addresses are stable prior to chip enable going active. For the 70-ns cycle, the addresses must  
be stable within 10 ns after the start of the read cycle.  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jul. 2008  
Revision : 1.2 5/14  
 复制成功!