ESMT
M13S64164A
Operation Temperature Condition -40°C~85°C
PACKING DIMENSIONS
66-LEAD
TSOP(II)
DRAM(400mil)
Symbol
Dimension in inch
Dimension in mm
Min
Norm
Max
Min
Norm
Max
A
A1
A2
b
b1
c
c1
D
ZD
E
0.047
0.006
0.041
0.015
0.013
0.008
0.006
1.2
0.002
0.037
0.009
0.009
0.005
0.0047
0.004
0.039
0.05
0.95
0.22
0.22
0.12
0.12
0.1
1
0.15
1.05
0.38
0.33
0.21
0.16
0.012
0.3
0.005
0.127
22.22 BSC
0.71 REF
11.76
10.16 BSC
0.65 BSC
0.5
0.875 BSC
0.028 REF
0.463
0.400 BSC
0.026 BSC
0.02
0.455
0.016
0.471
0.024
11.56
0.4
11.96
0.6
E1
e
L
L1
θ°
0.031 REF
0.80 REF
0°
10°
8°
20°
0°
10°
8°
20°
θ1°
15°
15°
Elite Semiconductor Memory Technology Inc.
Publication Date : Mar. 2009
Revision : 1.0
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