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M13S2561616A-6BIG2K 参数 Datasheet PDF下载

M13S2561616A-6BIG2K图片预览
型号: M13S2561616A-6BIG2K
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, BGA-60]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 49 页 / 1234 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M13S2561616A (2K)  
Operation Temperature Condition -40°C~85°C  
Read with Auto Precharge (@ BL=8)  
0
1
2
3
4
5
6
7
8
9
10  
C L K  
C L K  
H I G H  
C K E  
C S  
R A S  
C A S  
B A 0 , B A 1  
BAa  
BAa  
A
1 0 /A P  
A D DR  
( A 0 ~ A n )  
C a  
R a  
W E  
A u t o p r e c h a r g e s t a r t  
R P  
t
N o t e 1  
D Q S ( C L = 2 )  
D Q ( C L = 2 )  
Q a 4 Q a 5  
Q a 7  
Q a 2  
Qa 6  
Q a 1  
Q a 3  
Q a 0  
D Q S ( C L = 2 . 5 )  
D Q ( C L = 2 . 5 )  
Q a 4 Qa 5  
Qa 6 Q a 7  
Q a 2 Q a 3  
Q a 1  
Q a 0  
D M  
C O M M A N D  
ACTIVE  
READ  
:
D o n ’ t c a r e  
0 9 11 2 B 1 6 R . A  
Note: 1. The row active command of the precharge bank can be issued after tRP from this point.  
The new read/write command of another activated bank can be issued from this point.  
At burst read/write with auto precharge, CAS interrupt of the same/another bank is illegal.  
Elite Semiconductor Memory Technology Inc.  
Publication Date : May 2010  
Revision : 1.2 34/49  
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