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M12S128168A-6BG 参数 Datasheet PDF下载

M12S128168A-6BG图片预览
型号: M12S128168A-6BG
PDF下载: 下载PDF文件 查看货源
内容描述: 2M ×16位×4银行同步DRAM [2M x 16 Bit x 4 Banks Synchronous DRAM]
分类和应用: 存储内存集成电路动态存储器
文件页数/大小: 45 页 / 1036 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M12S128168A  
DEVICE OPERATIONS (Continued)  
dividing tRCD(min) with cycle time of the clock and then rounding  
of the result to the next higher integer. The SDRAM has four  
internal banks in the same chip and shares part of the internal  
circuitry to reduce chip area, therefore it restricts the activation  
of four banks simultaneously. Also the noise generated during  
sensing of each bank of SDRAM is high requiring some time  
for power supplies to recover before another bank can be  
sensed reliably. tRRD(min) specifies the minimum time required  
between activating different bank. The number of clock cycles  
required between different bank activation must be calculated  
similar to tRCD specification. The minimum time required for the  
bank to be active to initiate sensing and restoring the complete  
row of dynamic cells is determined by tRAS(min). Every SDRAM  
bank activate command must satisfy tRAS(min) specification  
before a precharge command to that active bank can be  
asserted. The maximum time any bank can be in the active  
state is determined by tRAS (max) and tRAS(max) can be  
calculated similar to tRCD specification.  
DQM OPERATION  
The DQM is used mask input and output operations. It  
works similar to OE during operation and inhibits writing  
during write operation. The read latency is two cycles from  
DQM and zero cycle for write, which means DQM masking  
occurs two cycles later in read cycle and occurs in the  
same cycle during write cycle. DQM operation is  
synchronous with the clock. The DQM signal is important  
during burst interrupts of write with read or precharge in  
the SDRAM. Due to asynchronous nature of the internal  
write, the DQM operation is critical to avoid unwanted or  
incomplete writes when the complete burst write is  
required. Please refer to DQM timing diagram also.  
PRECHARGE  
The precharge is performed on an active bank by  
asserting low on clock cycles required between bank  
activate and clock cycles required between bank activate  
BURST READ  
and CS , RAS , WE and A10/AP with valid BA0~BA1  
of the bank to be procharged. The precharge command  
can be asserted anytime after tRAS(min) is satisfy from the  
bank active command in the desired bank. tRP is defined  
as the minimum number of clock cycles required to  
complete row precharge is calculated by dividing tRP with  
clock cycle time and rounding up to the next higher  
integer. Care should be taken to make sure that burst  
write is completed or DQM is used to inhibit writing before  
precharge command is asserted. The maximum time any  
bank can be active is specified by tRAS(max). Therefore,  
each bank has to be precharge with tRAS(max) from the  
bank activate command. At the end of precharge, the  
bank enters the idle state and is ready to be activated  
again. Entry to power-down, Auto refresh, Self refresh and  
Mode register set etc. is possible only when all banks are  
in idle state.  
The burst read command is used to access burst of data on  
consecutive clock cycles from an active row in an active bank.  
The burst read command is issued by asserting low on CS  
and RAS with WE being high on the positive edge of the  
clock. The bank must be active for at least tRCD(min) before the  
burst read command is issued. The first output appears in CAS  
latency number of clock cycles after the issue of burst read  
command. The burst length, burst sequence and latency from  
the burst read command is determined by the mode register  
which is already programmed. The burst read can be initiated  
on any column address of the active row. The address wraps  
around if the initial address does not start from a boundary  
such that number of outputs from each I/O are equal to the  
burst length programmed in the mode register. The output  
goes into high-impedance at the end of burst, unless a new  
burst read was initiated to keep the data output gapless. The  
burst read can be terminated by issuing another burst read or  
burst write in the same bank or the other active bank or a  
precharge command to the same bank. The burst stop  
command is valid at every page burst length.  
AUTO PRECHARGE  
The precharge operation can also be performed by using  
auto precharge. The SDRAM internally generates the  
timing to satisfy tRAS(min) and “tRP” for the programmed burst  
length and CAS latency. The auto precharge command is  
issued at the same time as burst write by asserting high on  
A10/AP, the bank is precharge command is asserted.  
Once auto precharge command is given, no new  
commands are possible to that particular bank until the  
bank achieves idle state.  
BURST WRITE  
The burst write command is similar to burst read command  
and is used to write data into the SDRAM on consecutive clock  
cycles in adjacent addresses depending on burst length and  
burst sequence. By asserting low on CS , CAS and WE  
with valid column address, a write burst is initiated. The data  
inputs are provided for the initial address in the same clock  
cycle as the burst write command. The input buffer is  
deselected at the end of the burst length, even though the  
internal writing can be completed yet. The writing can be  
complete by issuing a burst read and DQM for blocking data  
inputs or burst write in the same or another active bank. The  
burst stop command is valid at every burst length. The write  
burst can also be terminated by using DQM for blocking data  
and precharge the bank tRDL after the last data input to be  
written into the active row. See DQM OPERATION also.  
FOUR BANKS PRECHARGE  
Four banks can be precharged at the same time by using  
Precharge all command. Asserting low on CS , RAS ,  
and WE with high on A10/AP after all banks have  
satisfied tRAS(min) requirement, performs precharge on all  
banks. At the end of tRP after performing precharge all, all  
banks are in idle state.  
Elite Semiconductor Memory Technology Inc.  
Publication Date: Apr. 2008  
Revision: 1.1  
12/45