ESMT
M12L64164A
Operation Temperature Condition -40°C~85°C
PACKING DIMENSIONS
54-LEAD TSOP(II) SDRAM (400mil) (1:3)
-H-
SEE
DETAIL A
D
A
2
A
54
28
0.21 REF
0.665 REF
B
B
1
A
O
-C-
E
E1
PIN1
IDENTIFIER
L
1
L
DETAIL "A"
b
1
27
-C-
c 1
c
-C-
0.10
b
e
1
b
SEATING PLANE
SECTION B-B
Symbol Dimension in mm Dimension in inch
Min Norm Max Min Norm Max
A
A1
A2
b
b1
c
c1
D
E
1.20
0.047
0.05 0.10 0.15 0.002 0.004 0.006
0.95 1.00 1.05 0.037 0.039 0.041
0.25
0.25 0.35 0.40 0.010 0.014 0.016
0.12 0.21 0.005 0.008
0.10 0.127 0.16 0.004 0.005 0.006
0.45 0.010
0.018
22.22 BSC
11.76 BSC
10.16 BSC
0.875 BSC
0.463 BSC
0.400 BSC
E1
L
0.40 0.50 0.60 0.016 0.020 0.024
L1
e
0.80 REF
0.80 BSC
0.031 REF
0.031 BSC
Θ
0°
10°
0°
10°
Elite Semiconductor Memory Technology Inc.
Publication Date: Dec. 2007
Revision: 1.2 43/45
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
