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M12L64164A2Y 参数 Datasheet PDF下载

M12L64164A2Y图片预览
型号: M12L64164A2Y
PDF下载: 下载PDF文件 查看货源
内容描述: 1M ×16位×4银行 [1M x 16 Bit x 4 Banks]
分类和应用:
文件页数/大小: 45 页 / 1260 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT
SIMPLIFIED TRUTH TABLE
COMMAND
Register
Refresh
Mode Register set
Auto Refresh
Entry
Self
Refresh
Exit
CKEn-1 CKEn
H
H
L
H
H
X
H
L
H
X
X
CS RAS CAS
L
L
L
H
L
L
L
L
H
X
L
H
L
L
H
X
H
L
WE
M12L64164A (2Y)
DQM
X
X
X
X
X
X
BA0
A11,
A10/AP
BA1
A9~A0
OP CODE
X
X
V
V
Row Address
Column
L
Address
H
(A0~A7)
Column
L
Address
H
(A0~A7)
X
V
X
L
H
X
Note
1,2
3
3
3
3
4
4,5
4
4,5
6
L
H
H
X
H
H
Bank Active & Row Addr.
Read &
Column Address
Write &
Column Address
Burst Stop
Precharge
Bank Selection
All Banks
Entry
Exit
Entry
Precharge Power Down Mode
Exit
DQM
No Operating Command
Auto Precharge Disable
Auto Precharge Enable
Auto Precharge Disable
Auto Precharge Enable
H
H
H
X
X
X
L
L
L
H
L
X
H
L
H
L
H
L
H
H
L
X
H
X
X
H
X
H
X
X
H
L
H
H
X
H
X
X
H
X
H
X
H
L
L
L
X
H
X
X
H
X
H
X
H
X
X
X
V
Clock Suspend or
Active Power Down Mode
H
L
H
L
H
L
X
X
X
X
X
X
V
X
X
X
7
L
H
H
H
X
Note:
(V = Valid, X = Don’t Care. H = Logic High, L = Logic Low)
1.OP Code: Operating Code
A0~A11 & BA0, BA1: Program keys. (@ MRS)
2.MRS can be issued only at all banks precharge state.
A new command can be issued after 2 CLK cycles of MRS.
3.Auto refresh functions are as same as CBR refresh of DRAM.
The automatical precharge without row precharge of command is meant by “Auto”.
Auto/self refresh can be issued only at all banks idle state.
4.BA0, BA1 : Bank select addresses.
If both BA0 and BA1 are “Low” at read, write, row active and precharge, bank A is selected.
If both BA0 is “Low” and BA1 is “High” at read, write, row active and precharge, bank B is selected.
If both BA0 is “High” and BA1 is “Low” at read, write, row active and precharge, bank C is selected.
If both BA0 and BA1 are “High” at read, write, row active and precharge, bank D is selected
If A10/AP is “High” at row precharge, BA0 and BA1 is ignored and all banks are selected.
5.During burst read or write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at t
RP
after the end of burst.
6.Burst stop command is valid at every burst length.
7.DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (write DQM latency is 0), but
makes Hi-Z state the data-out of 2 CLK cycles after.(Read DQM latency is 2)
Elite Semiconductor Memory Technology Inc.
Publication Date: May 2012
Revision: 1.1
7/45