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M12L2561616A-7TIG2K 参数 Datasheet PDF下载

M12L2561616A-7TIG2K图片预览
型号: M12L2561616A-7TIG2K
PDF下载: 下载PDF文件 查看货源
内容描述: [Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-54]
分类和应用: 动态存储器光电二极管内存集成电路
文件页数/大小: 45 页 / 933 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M12L2561616A (2K)  
Operation Temperature Condition -40°C~85°C  
CLK  
COMMANDS  
H
CKE  
Mode register set command  
CS  
RAS  
( CS ,RAS , CAS , WE = Low)  
CAS  
The M12L2561616A has a mode register that defines how the device operates.  
In this command, A0~A12, BA0 and BA1 are the data input pins. After power on, the  
mode register set command must be executed to initialize the device.  
The mode register can be set only when all banks are in idle state.  
During 2CLK following this command, the M12L2561616A cannot accept any  
other commands.  
WE  
BA0, BA1  
A10  
Add  
Fig. 1 Mode register set  
command  
CLK  
Activate command  
H
CKE  
CS  
( CS ,RAS = Low, CAS , WE = High)  
RAS  
The M12L2561616A has four banks, each with 8,192 rows.  
This command activates the bank selected by BA1 and BA0 (BS) and a row  
address selected by A0 through A12.  
CAS  
WE  
This command corresponds to a conventional DRAM’s RAS falling.  
BA0, BA1  
(Bank select)  
A10  
Row  
Row  
Add  
Fig. 2 Row address strobe and  
bank active command  
Precharge command  
CLK  
H
( CS ,RAS , WE = Low, CAS = High )  
CKE  
CS  
This command begins precharge operation of the bank selected by BA1 and BA0  
(BS). When A10 is High, all banks are precharged, regardless of BA1 and BA0.  
When A10 is Low, only the bank selected by BA1 and BA0 is precharged.  
After this command, the M12L2561616A can’t accept the activate command to  
the precharging bank during tRP (precharge to activate command period).  
RAS  
CAS  
This command corresponds to a conventional DRAM’s RAS rising.  
WE  
BA0, BA1  
(Bank select)  
A10  
(Precharge select)  
Add  
Fig. 3 Precharge command  
Elite Semiconductor Memory Technology Inc.  
Publication Date: Jun. 2012  
Revision: 1.4  
13/45