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M12L128168A-7TG 参数 Datasheet PDF下载

M12L128168A-7TG图片预览
型号: M12L128168A-7TG
PDF下载: 下载PDF文件 查看货源
内容描述: 2M ×16位×4银行同步DRAM [2M x 16 Bit x 4 Banks Synchronous DRAM]
分类和应用: 存储内存集成电路光电二极管动态存储器时钟
文件页数/大小: 43 页 / 786 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M12L128168A  
DEVICE OPERATIONS (Continued)  
AUTO REFRESH  
SELF REFRESH  
The storage cells of SDRAM need to be refreshed every 64ms  
to maintain data. An auto refresh cycle accomplishes refresh of  
a single row of storage cells. The internal counter increments  
automatically on every auto refresh cycle to refresh all the  
rows. An auto refresh command is issued by asserting low on  
CS , RAS and CAS with high on CKE and WE . The auto  
refresh command can only be asserted with all banks being in  
idle state and the device is not in power down mode (CKE is  
high in the previous cycle). The time required to complete the  
auto refresh operation is specified by tRFC(min). The minimum  
number of clock cycles required can be calculated by driving  
tRFC with clock cycle time and them rounding up to the next  
higher integer. The auto refresh command must be followed by  
NOP’s until the auto refresh operation is completed. The auto  
refresh is the preferred refresh mode when the SDRAM is  
being used for normal data transactions. The auto refresh  
cycle can be performed once in 15.6us.  
The self refresh is another refresh mode available in the  
SDRAM. The self refresh is the preferred refresh mode for  
data retention and low power operation of SDRAM. In self  
refresh mode, the SDRAM disables the internal clock and  
all the input buffers except CKE. The refresh addressing  
and timing is internally generated to reduce power  
consumption.  
The self refresh mode is entered from all banks idle state  
by asserting low on CS , RAS , CAS and CKE with  
high on WE . Once the self refresh mode is entered, only  
CKE state being low matters, all the other inputs including  
clock are ignored to remain in the refresh.  
The self refresh is exited by restarting the external clock  
and then asserting high on CKE. This must be followed by  
NOP’s for a minimum time of tRFC before the SDRAM  
reaches idle state to begin normal operation. It is  
recommended to use burst 4096 auto refresh cycles  
immediately before and after self refresh.  
Elite Semiconductor Memory Technology Inc.  
Publication Date: Oct. 2006  
Revision: 2.0  
12/43