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M12L128168A-5TIG2N 参数 Datasheet PDF下载

M12L128168A-5TIG2N图片预览
型号: M12L128168A-5TIG2N
PDF下载: 下载PDF文件 查看货源
内容描述: [Synchronous DRAM, 8MX16, 5ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-54]
分类和应用: 动态存储器光电二极管内存集成电路
文件页数/大小: 45 页 / 684 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M12L128168A (2N)  
Operation Temperature Condition -40°C~85°C  
DEVICE OPERATIONS (Continued)  
rounding of the result to the next higher integer. The SDRAM  
has four internal banks in the same chip and shares part of the  
internal circuitry to reduce chip area, therefore it restricts the  
activation of four banks simultaneously. Also the noise  
generated during sensing of each bank of SDRAM is high  
requiring some time for power supplies to recover before  
another bank can be sensed reliably. tRRD(min) specifies the  
minimum time required between activating different bank. The  
number of clock cycles required between different bank  
activation must be calculated similar to tRCD specification. The  
minimum time required for the bank to be active to initiate  
sensing and restoring the complete row of dynamic cells is  
determined by tRAS(min). Every SDRAM bank activate  
DQM OPERATION  
The DQM is used mask input and output operations. It  
works similar to OE during operation and inhibits writing  
during write operation. The read latency is two cycles from  
DQM and zero cycle for write, which means DQM masking  
occurs two cycles later in read cycle and occurs in the  
same cycle during write cycle. DQM operation is  
synchronous with the clock. The DQM signal is important  
during burst interrupts of write with read or precharge in  
the SDRAM. Due to asynchronous nature of the internal  
write, the DQM operation is critical to avoid unwanted or  
incomplete writes when the complete burst write is  
required. Please refer to DQM timing diagram also.  
command must satisfy  
tRAS(min) specification before a  
precharge command to that active bank can be asserted. The  
maximum time any bank can be in the active state is  
determined by tRAS(max) and tRAS(max) can be calculated  
similar to tRCD specification.  
PRECHARGE  
The precharge is performed on an active bank by  
asserting low on clock cycles required between bank  
activate and clock cycles required between bank activate  
BURST READ  
and CS , RAS , WE and A10/AP with valid BA0~BA1  
of the bank to be precharged. The precharge command  
can be asserted anytime after tRAS(min) is satisfy from the  
bank active command in the desired bank. tRP is defined  
as the minimum number of clock cycles required to  
complete row precharge is calculated by dividing tRP with  
clock cycle time and rounding up to the next higher  
integer. Care should be taken to make sure that burst  
write is completed or DQM is used to inhibit writing before  
precharge command is asserted. The maximum time any  
bank can be active is specified by tRAS(max). Therefore,  
each bank has to be precharge with tRAS(max) from the  
bank activate command. At the end of precharge, the  
bank enters the idle state and is ready to be activated  
again. Entry to power-down, Auto refresh, Self refresh and  
Mode register set etc. is possible only when all banks are  
in idle state.  
The burst read command is used to access burst of data on  
consecutive clock cycles from an active row in an active bank.  
The burst read command is issued by asserting low on CS  
and RAS with WE being high on the positive edge of the  
clock. The bank must be active for at least tRCD(min) before the  
burst read command is issued. The first output appears in CAS  
latency number of clock cycles after the issue of burst read  
command. The burst length, burst sequence and latency from  
the burst read command is determined by the mode register  
which is already programmed. The burst read can be initiated  
on any column address of the active row. The address wraps  
around if the initial address does not start from a boundary  
such that number of outputs from each I/O are equal to the  
burst length programmed in the mode register. The output  
goes into high-impedance at the end of burst, unless a new  
burst read was initiated to keep the data output gapless. The  
burst read can be terminated by issuing another burst read or  
burst write in the same bank or the other active bank or a  
precharge command to the same bank. The burst stop  
command is valid at every page burst length.  
AUTO PRECHARGE  
The precharge operation can also be performed by using  
auto precharge. The SDRAM internally generates the  
timing to satisfy tRAS(min) and “tRP” for the programmed  
burst length and CAS latency. The auto precharge  
command is issued at the same time as burst write by  
asserting high on A10/AP, the bank is precharge command  
is asserted. Once auto precharge command is given, no  
new commands are possible to that particular bank until  
the bank achieves idle state.  
BURST WRITE  
The burst write command is similar to burst read command  
and is used to write data into the SDRAM on consecutive clock  
cycles in adjacent addresses depending on burst length and  
burst sequence. By asserting low on CS , CAS and WE  
with valid column address, a write burst is initiated. The data  
inputs are provided for the initial address in the same clock  
cycle as the burst write command. The input buffer is  
deselected at the end of the burst length, even though the  
internal writing can be completed yet. The writing can be  
complete by issuing a burst read and DQM for blocking data  
inputs or burst write in the same or another active bank. The  
burst stop command is valid at every burst length. The write  
burst can also be terminated by using DQM for blocking data  
and precharge the bank tRDL after the last data input to be  
written into the active row. See DQM OPERATION also.  
FOUR BANKS PRECHARGE  
Four banks can be precharged at the same time by using  
Precharge all command. Asserting low on CS , RAS ,  
and WE with high on A10/AP after all banks have  
satisfied tRAS(min) requirement, performs precharge on all  
banks. At the end of tRP after performing precharge all, all  
banks are in idle state.  
Elite Semiconductor Memory Technology Inc.  
Publication Date: May 2012  
Revision: 1.1  
11/45